BSC Subracks

This describes BSC subracks. BSC subracks are used to integrate boards and backplanes into an independent unit. BSC subracks are functionally classified into the GSM main processing subrack (GMPS), GSM extended processing subrack (GEPS), and GSM transcoder subrack (GTCS).

• Components of the BSC Subrack
  This describes the components of the BSC subrack. The BSC subrack consists of the fan box, slots, front cable trough, and backplane.
• BSC Fan Box
  The fan box is used to dissipate the heat generated by the BSC. Each subrack must be configured with one fan box.
• BSC Slots
  This describes the BSC slots. A backplane is positioned in the center of the BSC subrack. The BSC boards are installed on the front and rear sides of the backplane.
• DIP Switches on the BSC Subrack
  This describes the DIP switch on the BSC subrack. The DIP switch on the BSC subrack is used to define the numbering of the BSC subrack.
• Configuration of the BSC Subrack
  The BSC subracks are classified into the GMPS, GEPS, and GTCS. This describes the recommended configurations of these subracks in different application scenarios and combination modes.
• Technical Specifications of the BSC Subrack
  The technical specifications of the BSC Subrack consist of the dimensions, height of the available space, weight of the subrack, and power consumption of the fully configured subrack.